Image 1 of 6
Image 2 of 6
Image 3 of 6
Image 4 of 6
Image 5 of 6
Image 6 of 6
specifications
Construction material: Aluminum alloy/Titanium alloy
Dimensions: About 157.4x85.1x28mm
Weight: About 556g (aluminum alloy), About 630g (titanium alloy)
RAM: 8GB ROM: 256GB (approximately 241GB usable)
Storage expansion: Two microSD card slots, theoretically supporting up to 4TB (2TB per card)
Hardware configurations
Main SoC: Qualcomm
Dragonwing QCS6490
DAC: ES9039SPRO*2
USB: XMOS XU316
Bluetooth: QCC5181
Display: 5.99-inch (1080x2160) fully laminated
Battery capacity: 9200mAh
Bluetooth specifications
Bluetooth reception: Bluetooth 5.4, SBC/AAC/aptX/apt Lossless/apt HD/ aptX Adaptive/LDAC Bluetooth transmission: Bluetooth 5.2, SBC/AAC/aptX/aptX HD/aptX Adaptive/ LDAC/LHDC
Decoding specifications
Local playback: 768kHz/32bit; DSD512 (Native)
USB DAC: 768kHz/32bit; DSD512 (Native)
USB Audio: 768kHz/32bit; DSD512 (supports DoP/D2P/Native)
Coaxial output: 384kHz/24bit; DSD128 (DoP/D2P)
Optical output: 192kHz/24bit
Coaxial decoding: 192kHz/24bit
Headphone output
Balanced output power 1: L+R≥5000mW+5000mW (325, THD+N< 1%, 12.7Vrms, Ultra high gain mode)
Balanced output power 2: L+R≥2250mW+2250mW THD+N< THD+N<1%, 8.5Vrms, Super high gain mode)
Balanced output power 3: L+R≥805mW+805mW (300S, THD+N< 1%, 15.5Vrms, Ultra high gain mode)
Balanced output power 4: L+R≥320mW+320mW (3002, THD+N< 1%, 9.8Vrms, Super high gain mode)
Single-ended output power 1: L+R≥1800mW+1800mW (328, THD+N< 1%, 7.6Vrms, Ultra high gain mode)
Single-ended output power 2: L+R≥660mW+660mW (322, THD+N<1%, 4.6Vrms, Super high gain mode) Single-ended output power 3: L+R≥200mW+200mW (300S, THD+N<1%, 7.8Vrms, Ultra high gain mode) Single-ended output power 4: L+R≥80mW+80mW THD+N< THD+N<1%, 4.9Vrms, Super high gain mode
Balanced LO audio specifications
Frequency response: 20Hz~85KHZ: Attenuation < 2.1dB
SNR: ≥127dB (A-weighted)
Noise floor: <1.9uV (A-weighted)
THD+N: 0.0027% (1kHz/-5dB@3252)
Crosstalk: ≥107dB
Line output level: 4.2Vrms (1kHz@10k2)